เครื่องยกชิพ BGA Rework Station XDF-D1

Specifications and Technical parameters:

1 Total   Power   rate: 5KW

2 Upper heating power: 0.6KW

3 bottom heating power: 0.6KW

4 thermostatic heating power: 3KW

4 Power       source: 220V ± 10  50Hz ± 3

5 Dimensions: 800 × 500 × 580mm         

6 . Temperature control: K -type thermocouple      

7 . Positioning mode: V -type slot, heterosexual clip PCB positioning,

    8 Maximum adapt PCB size 470 × 400mm

9 . Weight: 35 ~ 40kg

Second, the special  points:

1 man-machine intelligent fuzzy temperature control, precise control of BGA desoldering process.

(2) can also set 10 segment temperature +10 segments constant temperature control, can also store 50 groups of temperature.

3 selection of imported high-precision thermocouples, realize the temperature accurately detect.

4 using upper and lower, constant temperature heating curve three separate temperature zones, high-power cross-flow rapid cooling fan principle to ensure that PCB in the welding process, will not be deformed.

5 The machine uses high-resolution interface, temperature heating curve details clearer, easier to analyze temperature parameters.

6 desoldering and soldering is completed with alarm function, in the case of temperature control circuit can automatically stop heating output, with over-temperature protection.

  7 welded part can be targeted hot air heating curve up and down alone, according to the position of the chip up and down height adjustment, random with the opposite sex clip, for different shapes of the motherboard can easily handle the welding work.

  8 for large heat capacity PCB and other high requirements, lead-free soldering and so can easily handle.